Intel breaks ground on wafer fabrication facility in Dalian
Intel has broken ground on its first 300mm wafer fabrication facility in Asia.
The new factory, named Fab 68, will extend Intel's manufacturing leadership, while helping cultivate engineering talent, accelerate the growth of China's information technology (IT) ecosystem, and bring Intel's culture of environmental leadership to China.
The US$2.5bn (€1.81bn) project is set to begin construction immediately and be operational in 2010. Fab 68 will cover 163,000m2 of factory space and host a 15,000m2 cleanroom.
"Fab 68 will have world-class infrastructure and be an integral part of our global manufacturing network while bringing us closer to our customers and partners in China," said Craig Barrett, chairman, Intel Corporation.
Demonstrating its dedication to sustainable growth in Dalian, Fab 68 will be designed and built to minimise impact on the environment. "The design standards for Fab 68 meet Intel's high standards for environmental performance in all areas including water, energy and chemical waste management." said Kirby Jefferson, general manager of Fab 68.
Intel investment in Fab 68 brings its total investment in China close to US$4bn (€2.9bn). Intel has established two assembly and test plants in Shanghai and Chengdu, along with r&d centres and labs in Beijing, Shanghai and elsewhere in China.